Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: PIC International Conference 28th & 29th June

15:55 Hybrid Integration Platform for Co-Packaged Photonics Using POET’s CMOS Based Optical Interposer Presented by Suresh Venkatesan - POET Technologies

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agenda.pdf

 

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