OFC Presentation 12:30-13:00 PST

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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slab

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OFC Presentation 12:30-13:00 PST

posted on Mar 09, 2022 04:01PM

This just finished. I wonder how well it was received?

Technology Showcase: Hybrid Integration Platform for Co-Packaged Photonics Using POET’s CMOS Based Optical Interposer

POET will demonstrate Optical Interposer Platform for 100/200G CWDM/LR4, scaling to

400G FR4 and 1.6T/3.2/6.4T co-packaged optics. A unique hybrid integration platform extends

Silicon Photonics to enable wafer-scale manufacturing of fully integrated electronics and

photonics using passive flip-chip bonding, resulting in a single chip optical engine, featuring