OFC Technology Showcases

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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OFC Technology Showcases

posted on Feb 18, 2022 01:19PM

Technology Showcase: Hybrid Integration Platform for Co-Packaged Photonics Using POET’s CMOS Based Optical Interposer

Wednesday, 09 March, 12:30 – 13:00 PST (UTC-8:00)

Theater III

Speaker: Dr. Suresh Venkatesan, CEO, POET Technologies

POET will demonstrate Optical Interposer Platform for 100/200G CWDM/LR4, scaling to 400G FR4 and 1.6T/3.2/6.4T co-packaged optics. A unique hybrid integration platform extends Silicon Photonics to enable wafer-scale manufacturing of fully integrated electronics and photonics using passive flip-chip bonding, resulting in a single chip optical ...

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Technology Showcases | OFC (ofcconference.org)

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