Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Smaller is better - health monitoring wearables

Lot's of word salad. Have you seen anything that relates to Rockley's footprint or power consumption, insertion loss, transmission loss, RF limits. Try and find it. It's pretty much out in the open for POET. You are aware of the importance of losses I assume.

Here are some metrics you might want to review:

 

IMEC [11,12]

HP [13,14]

Luxtera/TSMC [5]

ST Microelectronics [6,15]

Technology

       

 Availability

Prototyping/Research

Prototyping/Research

High-volume

High-volume

 Integration Method

Wire-bond

Wire-bond

3D Cu-pillar

3D Cu-pillar

 Photonics process node

220 nm SOI

130 nm SOI CMOS

130 nm SOI CMOS

PIC25G SOI

 Circuits process node

28 nm/40 nm CMOS

65 nm CMOS

28 nm CMOS

55 nm BiCMOS/65 nm CMOS

 NFET fT

275 GHz/305 GHz

N/R

N/R

300 GHz/200 GHz

 Wavelength

1550 nm

1550 nm

1310 nm

1310 nm

Photonics Performances

       

 Waveguide Loss

1 dB/cm

3 dB/cm

1.9 dB/cm

3 dB/cm

 Couplers Loss

2 dB

5 dB

2.2 dB

2.15 dB

 Modulator Device

Ring-resonator

Ring-resonator

MZM

MZM

 Modulator Bandwidth

38 GHz

N/R

25 Gb/s

25 Gb/s

 PD Responsivity

0.8 A/W

0.45 A/W

1 A/W

0.88 A/W

 PD Bandwidth

50 GHz

30 GHz

24 GHz

20 GHz

System Performances

       

 Transmitter Data-rate

50 Gb/s

25 Gb/s

25 Gb/s

56 Gb/s

 Extinction Ratio (Insertion Loss)

5 dB (5 dB)

7 dB (5 dB)

4.2 dB (1.5 dB)

2.5 dB (7.5 dB)

 Transmitter Energy

0.61 pJ/b

2.5 pJ/b

N/R

5.35 pJ/b

 Receiver Data-rate

20 Gb/s

25 Gb/s

25 Gb/s

25 Gb/s

 Receiver Sensitivity

70 µA

72 µA

N/R

97 µApp

 Receiver Energy

0.58 pJ/b

0.68 pJ/b

N/R

1.24 pJ/b

N/R = Not Reported * High-volume assumes a 300mm foundry Modulator and driver energy efficiency

   

 

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