Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: It’s all about adding the bandwidth that silicon needs

SV: What we’re also seeing is a lot of interest in exascale computing. We do have projects and programs associated with providing highly integrated laser solutions for AI, for example. And there is also a lot of interest with regards to exascale computing as it relates to CPO or co-packaged optics. So we’re kind of seeing the conventional players interested in our platform for what it provides in the 100/200/400 and then we’re seeing the hyperscalers and the server compute guys interested in looking at what we’re doing for the co-packaged optics space which is quite exciting. 

What we’ve been able to demonstrate with our 100G systems is eye margins over 40%, where most other companies 100G systems will have eye margins around 25%. I mean they would consider that to be very good. We are consistently over 35% to 40% depending on the temperature. So the RF capability of our interposer is so clean because we completely eliminate the wire bonds. So even at extremely low power levels, we can create wide open eyes.

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