Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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There are a lot of unanswered questions regarding the long term viability of LWLG’s organic materials that I have never seen addressed. Until they have a product which has been stress tested in an actual prototype there is no way to predict the degradation curve. That I believe is a large part of the reason that POET is not considering LWLG and are instead utilizing silicon based modulation for continuous wave applications. 

Also POET is now focused on a very low cost solution using flip chip DML lasers. And by the way POET has performed very rigorous stress testing beyond the norm to accelerate qualification. The performance parameters are solid. Can't say that about LWLG. And it appears to me that LWLG will take every opportunity to promote, including news releases associated with patents issued. You can talk about patents all you want but comes a time where those patents must be applied and proven out by an actual product that meets customer requirements.

I believe that POET will be in a position to heavily promote all aspects of the POET platform including commercialization and business updates as they prepare for uplisting.

It is interesting to look at the history associated with the Centre of Excellence for Advanced Packaging in Singapore. This third phase has completely aligned to POET's approach to integration.

 

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