Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Hi Druk,

I'm no expert on this field, hence the question mark behind my post.

However, this sentence caught my attention:

"

Siliconization packaging technology which includes the silicon photonics integrated circuit (SiPh PIC), high-speed modulator driver and transimpedance amplifier (TIA) in a single opto-electronic package

"

 

 

 

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