Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Feb 23, 2021 08:59AM
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- OI platform has been extended and validated

- designed and demonstrated a DWDM Multiplexer embedded in the Optical Interposer waveguide layer

Requirements needed for high-performance optical sensing & Co-Packaged Optics (CPO) applications, such as optical computing chipsets for Artificial Intelligence.

Cheers

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Feb 23, 2021 11:55AM
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