Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Pillar 1: Data Centers

Optical engines for 100G, 200G, 400G, and 800G transceivers

Pillar 2: Telecommunications, including 5G networks

Pillar 3: Co-Packaged Optics

Pillar 4: High Performance Computing for Artificial Intelligence Applications "Edge"

Revenue projections have been provided for Pillar 1 only, revenue projections for the other 3 pillars will come in due course.

 

 

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