Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Co-packaged optics

The POET Optical Interposer is fabricated in a wafer-level process that is completely compatible with standard CMOS semiconductor processing, making it the solution to a long-sought-after means to co-packaged optics – building photonics communications capability directly into a chip – for high speed computing and networking applications.

https://www.youtube.com/watch?v=Esgyj26vdxs

Now take  a second look  at the detail provided in the Zacks Research Report. This evolution of the POET OI is  going to be a biggy and I smell a NA partnership on the way. I  think it is inevitable.

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