Re: Co-packaged optics
posted on
Jul 24, 2020 11:36AM
oz4m2: Absolutely Rainer, not in the electronics domain, but in the photonics domain - please
HPC for AI - (High Performance Computing for Artificial Intelligence Applications)
Yes, agreed, but this is something completely different, and I would not mix it up with the 7 nm process.
We don’t know who the customer is for whom POET is working on a “complete system-in-package for optical computing, all built on an optical interposer”, but I don’t think it is Intel. In my point of view, the analog devices don’t fit in for them. This smells more like a small, specialized company, perhaps from the Artificial Intelligence domain, which is exploring new ways off the traditional paths of computing.
Could also be a research project of a large company – Intel might get back into the game here –, but I doubt it. Nvidia? No, rather not, because in this case POET, em, Zacks would not have mentioned them.
From the Zacks report, highlights by me:
One such example that POET is working with a customer on is a complete system-in-package for optical computing, all built on an optical interposer. Taking advantage of a flexible platform for hybrid device integration, the optical interposer enables co-packaging of a variety of analog, digital, electronic, and photonics devices into a chip-level, self-contained computing accelerator. Its performance can match or exceed traditional processors from NVIDIA and others, but consumes a fraction of the power and can be manufactured for a fraction of the cost. By handling the mathematic computations required for Machine Learning (ML) and Deep Learning (DL) in the optical domain, rather than the digital electronic domain of a typical GPU, this technology is well suited for the low-power requirements of multiple Edge AI applications. POET’s Optical Interposer is extendable to self-contained optical systems now being developed for Artificial Intelligence applications.