Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: DenseLight COVER STORY

The whole 24-hours event is recorded and available on YouTube. You can jump directly to the DenseLight presentation using this link: https://www.youtube.com/watch?v=Vh0jVjvPFv4&feature=youtu.be&t=8544.

Rajan gives a solid presentation of the company and its product portfolio, the direct flip-chip to Silicon Photonics wafers or POET Optical Interposer wafers being one and the most innovative of three basically different packaging approaches to enable what he calls “platform agnostic” laser solutions. You can see this in particular on slides 8–10 (“innovative key enablers: integrated spot-size converter and flip-chip capability”).

Rajan’s presentation is – no surprise – a DenseLight presentation rather than a POET presentation, and not everything that has been developed while under the POET hood is labeled as such. However, you can see that these technologies are an major part of the DenseLight portfolio and strategy.

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