Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Shash

I think what may be misunderstood, is that POET is now perfecting the process of modifying certain elements within the die to make it more suitable for specific uses

 

From the April 2 Virtual Conference:

Platform expansion development (vertical mirrors,hermetic seal, external cavity) initiated.

 

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