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Message: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
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Re: DIE TESTING... WAS: Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

posted on Dec 02, 2019 11:25AM
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No other company has it Moska as of today.

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I guess I was asking if the patent they just secured is broad enough so as to ensure that NO ONE will be able to have ANY KIND of wafer-level testing without either infringing or paying royalties. 

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