Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
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Wouldn’t it be great to actually know that the tech patented is so key to the low cost and high efficiency solution which the OI is anticipated to represent, that no other comparable solution can be had without licensing the tech, buying the company or running the risk of infringing.  

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