Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: CC Transcript 2: Vivek Rajgarhia

Absolutely Sula. They are indeed a Dynamic Duo. 

On the subject of information and presentation of detail that could be provided on their website. I feel they will do what they can to provide greater clarity on what this platform is but there is a balancing act. The platform is so good that there will be a need to avoid giving out information that must be contained for competitive reasons.

What I am really starting to appreciate is how important this platform is. And that is clearly demonstrated by the Tier 1 customer that is financing the development of the 400G optical engine. The cost benefit is a huge motivator in an industry that is spending a lot of money to keep up.

Let’s look under the hood a little more.

First off just for clarity we are talking about CMOS friendly processes that do not require active alignment through lenses. So really low cost, small form factor and highly scalable.

You have to appreciate the achievement of exceptionally low insertion and transmission loss and what it ultimately means for the optical engine. It is briefly discussed in the video clip that was shared by Oz. 

Let’s simplify why this is important and how the POET platform uniquely manages this.

Loss of light means increased output is required by the laser. If you have to redline the laser you are doing two things. You are creating excessive heat and as a result accelerated aging and reduced reliability. Signal integrity begins to suffer. Noise is created and error rates rise. Valves begin to float and more horsepower is needed to get the job done.  

So we have this POET optical engine in a small form factor (it does not have to do the same work to get the job done) that effectively controls this universal problem in the most direct ways possible (a very cleaver design).

First by reducing the heat generated as a result of very efficient connectivity that does not leak. And secondly the heat that is generated is very well controlled within the required range of each die by spreading out the chips laterally and channeling the heat efficiently through the interposer design.

The supply chain is going to be very important which is typical within the industry. And there will be some real benefits to amalgamate some operations and be located in a technology hub close to our customers.  

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