Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Dynax Semiconductors INC

RF GaN MARKET: APPLICATIONS, PLAYERS, TECHNOLOGY AND SUBSTRATES 2019 Market & Technology Report - May 2019 

https://yole-i-micronews-com.osu.eu-west-2.outscale.com/uploads/2019/04/YD19016_RF_GaN_Market_Applications_Players_Technology_Substrates_April_-2019_Flyer.pdf

Dynax appear in the report:

COMPANIES CITED IN THE REPORT (non exhaustive list) Aethercomm, Aixtron, Akash Systems, Alcatel-Lucent, Ampleon, Anadigics, Arralis, AT&T, BAE Sytems, Bell Laboratory, Cisco, CETC, China Mobile, China Telecom, China Unicom, Cree, Custom MMIC, Dynax, DragonWave-X, Dowa, EADS, Enkris Semiconductor, Epigan, Ericsson, Eudyna, Freiburg/Univ. Ulm/Fraunhofer IAF, Filtronic, Freescale, Fujitsu, Global Communication Semiconductors, Hiwafer, Hittite/Keragis, Huawei, II-VI Inc, IMEC, IMECAS Infineon, Integra Technologies, Intel, IQE, KDDI, KT, LG Plus, Lockheed Martin, M/A-COM, Microsemi, Mitsubishi Chemical, Mitsubishi Electric, Motorola, NEC, Newport Wafer Fab, Nitronex, Norstel, Nokia Networks, Northrop Grumman, Norsat, NTT, NTT DOCOMO, NXP, OMMIC, Powdec, Qorvo, Qualcomm, RFHIC, RF Lambda, RFMD, Samsung, San’an Optoelectronics, SICC, SiCrystal, SK Telecom, Softbank, Sprint, STMicroelectronics, Sumitomo Electric, SweGan, Raytheon, TagoreTech,TankeBlue, Telstra, Thales, Thales III-V Lab, T-Mobile, Toshiba, Triquint, UMS, Unity Wireless, Verizon, Vodafone, Wavice, WIN Semiconductors, Wolfspeed, ZTE and more.

 

Power GaN Patent Assignees:

http://www.yole.fr/iso_upload/Samples/SAMPLE%20-%20GaN%20Devices%20for%20Power%20Electronics%20-%20Patent%20Investigation%202015.pdf

Other industrial patent assignees: Alpha & Omega Semiconductor, Toyoda Gosei, Delta Electronics, Japan Radio, NEC, Yaskawa, MicroGaN, RF Micro Devices (RFMD merged with Triquint = Qorvo), ABB Research Center, Delta Optoelectronics, Denso, Intersil, National Semiconductor, NGK Insulators, Northrop Grumman Systems, Schneider Electric, Soitec, Sumitomo Electric Device Innovations (SEDI), Dowa Electronics Materials, Eudyna Devices, Panasonic Electric Works, Schneider Toshiba Inverter, ST Microelectronics, Widebandgap, GaN Systems, Genesic Semiconductor, Hitachi Metals, Kansai Research Institute (KRI), Bosch, Siemens, Suzhou Jiexinwei Semi Tech, Triquint, Astriphey Applications, Azzurro Semiconductors (now ALLOS), Covalent Materials, Dynax Semiconductor, Emerson Network Power Energy, General Motors, IBM, Jiangsu Nenghua Microelectronic Technology Development, LG Innotek, Mersen, Philips, PowDec, Richtek Technology, Rockwell, Vishay Semiconductor, Daimler, Emcore, Enkris Semicondcutor, Adeka, Nippon Avionics, Thales, Arkansas Power Elec. Int. (APEI), Enphase Energy, General Motors, Kyocera, Lockheed Martin Corp., Nippon Steel & Sumitomo Metal .

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