When POET announced the orders from last Nov they did not provide any details of who the prototypes were for or specifically what it was they were building. I don’t think they are allowed to provide that information until the customers let them. And I think the deals have to be done before that information can be released. After all it is the customers who have paid the development costs so it would not be that unusual for the customer to control that news flow.   

We have not  been told that there are any technical  issues at all and if  there was it would  be pretty amazing that all the management and insiders that invested in the debentures would ignore such a deal  breaker. Again I very much believe that all the due diligence was satisfied by the buyer long before the sale was even announced. As far as we know the delays for sign off could be related to building permits being held up. Any number of reasons which are not under the control of POET and have nothing to do with the platform.

Poet Optical Interposer is a novel platform that facilitates the co-packaging of electronics and optics in a single chip scale package (CSP). The Optical Interposer, incorporating Poet's dielectric waveguide technology, reduces coupling and transmission losses below levels found in conventional and silicon-photonics-(SiPh)-based devices and allows passive optical alignment as well as automated wafer scale pick-and-place assembly and test. The result is a dramatic reduction in manufacturing costs, lower power consumption and often smaller form factors compared with other approaches, allowing Poet's customers to produce highly differentiated products across a range of advanced photonics applications.

Poet's chief executive officer, Dr. Suresh Venkatesan, commented: "We introduced the Optical Interposer in January of this year and have now received multiple orders from datacom and telecom industry leaders. This validates that we have a compelling photonics integration platform. The Optical Interposer enables manufacturers of conventional and silicon photonics transceiver modules to reduce costs and, in some cases, to cost-effectively transition from 100G to 400G products using a common platform architecture. We expect these current orders to lead to the inclusion of more of our Optical Interposer technology in current and future products, including 400G transceivers for datacom and low-cost devices targeted at the high-growth market for 5G cellular and next-generation access networks."