Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: Future ASIC applications
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Mar 01, 2019 02:04PM

Interesting article regarding future ASIC applications. Thanks to Lebowski101 (/Ayar Labs).

Ayar Labs prepares for the era of co-packaged optics 

THURSDAY, FEBRUARY 21, 2019 AT 8:49AM

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Wuischpard believes the tight coupling of optics with silicon is going to be ‘a big deal’. 

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Does this mean that the market opportunity for co-packaged optics requires companies to become partner suppliers to the likes of Broadcom and Nvidia that dominate the respective switch and GPU markets? 

“Generally that is correct; there are going to be a few large players who will be driving adoption,” says Wuischpard. But he highlights additional co-packaging opportunities.

One opportunity is the U.S. government and the system integrators that serve their opportunities. A second is the hyperscale data centre operators. “Ultimately, they are driving demand back to the Nvidias of this world,” says Wuischpard. “A lot of them are building their own custom silicon for certain workloads and use cases, particularly in AI.”

 
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Mar 01, 2019 03:56PM
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