Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Job Objectives

To develop and implement strategic plans to increase capacity, process capability, CAPEX and OPEX cost effectiveness within both the internal factory infrastructure (including all manufacturing sections from cleave coat and test, die attach, wire bond, packaging and integrated light source modules and test), and external factory infrastructure (all outsourcing partners and suppliers) to meet both immediate and planned revenue growth trajectory of the organization.

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