Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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China International Semiconductor Executive Summit beginning on Sept 18th with Suresh and the big name new guy in tow, a company indication that the testing cycles are complete and successful and a company indication that the die from Silterra have been successful packaged and sent on to Accelink and others for integration testing in their various products. Then someone will shout "we will buy them" !!!. Oh yes, and Almae announces that the platform has been integrated into one of their transmit devices and someone else shouts "we will by them"!!!

IMO of course

 

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