Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Poet - Industry awareness

Killer video (pun intended)

From the first part of the video, speaker explains some of the challenges facing the industry. Seems Poet is addressing many of these (cherry picked, of course).

Interesting that Michael Lebby indicated a key challenge for the development of technology is in the lack of actual equipment available to test speeds of 100G and beyond.  So, development is constrained by ability to test the technology you want to build.

The following challenges (among others) were identified in the short haul tel/datacom section.  Feel free to comment, perhaps I've misinterpreted things or Poet's anticipated capabilities.

Critical Challenges

Poet?

Advanced InP platforms with 4,8,16 channels for 400, 800 and 1600 Gps

Check, in development (ie 16 lanes?)

Lower power consumption

Check

Full integration of optics immediately adjacent to electronics

Check

Simpler optical coupling and non-hermetic packaging (ie or wafer level hermetic packaging)

Check

Wafer level test and assembly

Check

Technological Gaps

 

Achieve $1/Gbps @ 400Gpbs

Check?, check at 100Gbps

Athermal designs where TE cooler are not needed

Check

Advanced, higher performing, lower cost

Check

packaging using chip on board, passive alignment, integrated optics and electronics

Check

Full hetero structure for more advanced monolithic platforms

Check

Simple optical alignment

Check

Technological Challenges for Product

 

Wafer level test and assembly

Check

Demux and Mux for (C)WDM

Check

Improve yield

Check

Simple, cheap, low power, suitable for mass prod

Check & Check

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