No such message found

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

Free
Message: New presentation

look at the information entitled Datacom Production Milestones on page 26. It's all there in blue, black and white folks. See where it says multi-chip module qualification. That's what we are waiting on folks. Once that happens, Katie bar the door in my opinion. Then look to the right and see the products and the order they plan developing products; first, portfolio expansion to datacom, and then portfolio expansion to telecom, and then portfolio expansion to sensing (LIDAR). Then look at the plan for the 100 G product and again for the 400 G product. Wrap your brain around what this company can become. Read this page, and read it again, imo.  This tells us where we are at and where we are going. Where are we now? We are in the throws of MULTI CHIP QUALIFICATION. I hope someone asks how that is going at the meeting. It looks like when that is confirmed all the parts and pieces are in place for this to take off, in a BIG way!  

Good luck to all longs!

9
Jun 21, 2018 12:26PM
3
Jun 21, 2018 12:35PM
1
Jun 21, 2018 02:41PM
Share
New Message
Please login to post a reply