Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

Free
Message: Patent granted

Sorry if it's been posted before.

Patent awarded to BB Photonics last week.

Patent number: 9880352
Abstract: A photonic integrated circuit (PIC) is grown by epitaxy on a substrate. The PIC includes at least one active element, at least one passive element, and a dielectric waveguide. The at least one active and passive elements are formed over the substrate and are in optical contact with each other. The dielectric waveguide is formed over the substrate, and is in optical contact with the at least one active and passive elements. The at least one active and passive elements each are formed using a III-V compound semiconductor material.
Type: Grant
Filed: July 22, 2016
Date of Patent: January 30, 2018
Assignee: BB Photonics Inc.
Inventors: Miroslaw Florjanczyk, William Ring

 

Share
New Message
Please login to post a reply