Based on the news we received this week I would think that a significantly higher share price is justified and I believe there will be efforts to educate investors on how this platform offers industry a pathway forward. I think this optical interposer has the ability for very efficient optoelectronics using an in-plane fabrication flow that is a big departure from 3d bonding at the top of the silicon die. Some of the industry players will get it and some will not but I think it really does provide a new and efficient way for on chip optical communications. I would love to see it explained in a way that people could understand and I think we will see this effort in the very near future. 

We are witnessing very major accomplishments that people just don’t understand.