Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: One more job at Denselight

Well, if Fab A is, for all intents and purposes, the the "historic" fab process for the Broadband and SLED component production and packaging, good chance that Fab B is the InP/dielectric production and packaging? IMO 

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