Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Sell components now or sub-assembly chips next year?

I say do both oz...

I read something here in the last weeks that suggested if we sell the components now we would give up the sub-assemblies because the tech would be stolen and someone else would package them.

Do we not have protection for our patents?

Does Bill Ring have a patent for his dielectric waveguide?

Confused?

 

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