Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Value of the Tender bid
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Stiched: What's the timeline for the bidding processs?

The (extended) bid period will be closed on Thursday this week.

The offerer is asked to uphold his conditions until December, so I'd expect a decision by then, perhaps earlier.

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