Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: II-VI Incorporated Acquires Kaiam’s 6-inch Wafer Fabrication Facility in the U.K.

Denselight's lasers are already in the marketplace.

The dielectric platform is a fusion of Denselight and BBP tech.

The first product to market of the hybrid is the uncooled waveguide multiplexers/demultiplexer

There are no stand alone BBP components presently   

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