Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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According to Rainer's timeline see line 24 between April 1 and May 30

https://docs.google.com/spreadsheets/d/1_6VSZGqigLbjQyh_LJxMfpa4fc7pTbaj_8wtvRVDEW0/edit#gid=0

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