Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: We've been told before - our first tuck-in acquisition

From the first conference call held on Sep 30, 2015

04:53 – The strength of our balance sheet allows us the flexibility to exploit various opportunities that might present themselves, including M&A, tuck-in acquisition and numerous other ways to build this company on our own terms. That is, we fully intend to operate as a stand-alone company.

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