Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: Article on II-VI report/record bookings (epiworks and Anadigics)
Can someone who has a solid understanding of the poet technology have a look at the products that Trilumina are offering? From the quote I found online it appears they are offering a GaAs based VCSEL. TriLumina has developed unique architecture for two-dimensional arrays of Vertical Cavity Surface Emitting Lasers (VCSELs) that allow for simultaneous high-power output and high-bandwidth modulation. The arrays use integrated micro-lenses for beam shaping and control, and to enable incoherent beam combining to make compact, high-brightness sources with low coherence noise. In our approach to VCSEL array technology we use flip-chip bonding that employs a sub-mount. Here, the VCSEL die is constructed in gallium arsenide, then flip-chip bonded to a ceramic or silicon sub-mount that has patterned metal on its surface. Each of the individual VCSEL elements that make up the array is formed by a mesa structure … The anodes of the individual VCSEL elements are connected to the common sub-mount anode pad via solder bumps that are reflowed to the anode metallization of the sub-mount. The VCSEL elements are designed to emit light through the back of the substrate at wavelengths in the 905 to 980 nm range. Source: http://www.greencarcongress.com/2016/04/20160408-denso.html
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