Nice post, Fairchi.

You write:

"We have seen just how good the results are from this very efficient process that enables high volumes with very little capacity (it is very fast). The epitaxial layers are common to all GaAs POET devices and as such should make the integration a very efficient process utilizing the same layer for the same operation in each device. Integration should be very straight forward and seamless. The biggest steps have been achieved."

So, now that the biggest steps have been achieved, what are the smaller steps, tech-wise and manufacturing-wise, that remain? I'm not referring to the market for these items or marketing the items or partnering for sale and/or distribution, just about the tech and manufacture.

Thanks.