Re: Vikas Gupta on Linkedin about Poet NR.
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Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
Message: Vikas Gupta on Linkedin about Poet NR.
Raj Rajasekharan
Packaging Engineer at POET Technologies
San Francisco Bay AreaSemiconductors
Experience
Senior Engineer
PhotonIC Corp
2012 – 2015 (3 years)MCM Packaging, Silicon Photonics, Flip Chip technology, 2.5D package integration for silicon photonics, light coupling and laser subassembly.
Senior Manager, Package Technology Analysis & Development
Tessera Technology Inc.
2011 – 2012 (1 year)Packaging IP evaluation and Package Technology analysis. Provide technical feedback to legal teams.
Sr. Manager, Technical Programs
Amkor Technology
2007 – 2011 (4 years)Managing multiple package development programs including wirebond, FC, waferlevel packaging. Quality and reliability evaluations. Explore customer requirements by working with business units and provide roadmaps. Work with overseas factory to meet customer TT$ and quality requirements. Manage Package qualifications,NPI, work with customer to resolve end customer issues.
(Open)1 recommendation-
Darrell Baker
Director of Sales at Amkor Technology
Package Engg Manager
Intel Corporation
1998 – 2007 (9 years)Package development for CPU and chipset for mobile group. FC packages and wire bond packages for mobile products. Quality and reliability assurance for the packages both at first level and 2nd level. Work with OEMs and ODMs to solve package related issues. Drive board level reliability efforts with internal teams and OEMs.
Package Engg Manager/Sr MTS
Altera Corporation
1994 – 1998 (4 years)Subcon management for molded wire bonded packages. Co develop thermal packages with subcon by working closely with business units. Quality and reliability assurance for the packages. Managed multiple subcons and multiple programs.
Principal Engineer
Digital Equipment Corporation
1987 – 1993 (6 years)Optoelectronic package technology development, technology transfer. Program manager for Industry-Cornell University packaging alliance.
Post Doctoral fellow
Bowling Green State University
June 1986 – June 1987 (1 year 1 month)Low temperature solid state physics
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