Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: question for the board

jtb> So why is it not up for discussion on this board.

I can think of 2 reasons:

i) there's really nothing concrete to base it on, so it'd be just complete wild-arsed guessing, and

ii) January (the "granular detail" conference call) is close enough that it doesn't warrant spending the effort.

based on CIC and the other sorts of similar history, if there's meat in the upcoming roadshow that we don't already know, it's bound to leak out to us here in due time.

roadshow means new corp deck, so we should at least get the details in that as soon as it's out.

GLAL,

R.





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