Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Wafers ready in October
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Geoff:

3 key devices: NHFET, VCSELS, Detectors.

nHFET complete with BAE.

980nm VCSELs done, industry 850nm happening in parallel, ready for commercialization soon.

small-signal DOES lasers 8GHz, in the bag (readily 10Gbps), large-signal DOES this quarter.

integrated detector done

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