From this release from BAE .... is there more dots to connect? BAE is transitioning to Fabless as well? GlobalFoundries? TMSC?

http://www.baesystems.com/enhancedarticle/BAES_165977/a-tiny-boost?_adf.ctrl-state=883up9d4j_4&_afrLoop=1902598776773000&_afrWindowMode=0&_afrWindowId=null#!%40%40%3F_afrWindowId%3Dnull%26_afrLoop%3D1902598776773000%26_afrWindowMode%3D0%26_adf.ctrl-state%3Dlus768of8_4

In today’s power-constrained space missions, these smaller, faster and power-efficient chips deliver reliable and secure performance to previously unachievable space applications.

The development of 45-nanometer technology will position our space business for growth. Last year, we decided to transition to a “fabless” radiation-hardened electronics business model, closing the Semiconductor Technology Center foundry and outsourcing its wafer fabrication.

The market demand for the products that match the manufacturing capability of our in-house foundry just wasn’t there. By working with other commercial foundries to produce these products, we will be able to provide the higher-performing, more-power-efficient products that our customers are looking for.