interesting......

the following article written in February 2014 entitled

"Semiconductor Technology Offers Exciting Possibilities"

In an ideal world, the latest devices would come equipped with compact, power-efficient, and ultra-connected supercomputers in a single chip. This one-stop-shop solution seems to be the goal of semiconductor companies and foundries alike. The latest integrated-circuit (IC) technologies are looking to integrate analog, digital, and RF components on the same chip. By doing so, they could more easily cater to the growing demand for commercial and military portable electronics while offering “big data” capability.

To enable such features, however, these devices must implement the necessary hardware in a compact and power-efficient way. Many developed and newer technologies have been highlighted as solutions to this problem. For example, Fin field-effect-transistors-on-bulk (FinFETson-bulk), fully depleted silicon-on-insulator gallium arsenide (FDSOI GaAs), and FinFET-on-SOI are being considered by big players like GlobalFoundries, IBM, Intel, ST, Soitec, and many others. Of course, there are many manufacturing, cost, supply, and market factors that need to be detailed for engineers and companies to invest in a certain technology.

link to full article http://m.mwrf.com/semiconductors/semiconductor-technology-offers-exciting-possibilities