Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Technical Issues with new equipment - possible delay?
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On February 25, 2015, the Company signed a Collaboration Agreement with BAE Systems ("BAE"), under which BAE will provide non-exclusive third-party foundry services in support of the Company's "Lab-to-Fab" transition plan.

So they signed the Collaboration one month before the release (March 30, 2015) and one month before the issues with the new equipment were resolved.


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