Re: attracting attention from some of the biggest chipmakers,is the monolithic 3D IC

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Re: attracting attention from some of the biggest chipmakers,is the monolithic 3D IC

posted on Dec 06, 2014 05:20PM

And we should not forget:
3D-stacking will obviously create cooling problems! A 4GHz CPU is already now generating so much heat that it has to be throttled down to prevent heat-death. Mobile devices do not have active cooling systems. Stacking to 3D is decreasing the surface of a chip, which will cause huge problems to take away all the loss energy inside the stack: Compared to POET Si-chips are not really energy efficient!
Does anybody know how 3D-IC will solve this issue?

I see one nice solution for the future: 3D-POET!
Low heat + optical interconnects with POET!

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