Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: IBM is retaining Canadian Fab

Perhaps we should differentiate between "packaging" (= putting a chip into a casing) and "stacking" (= putting multiple chips above each other and interconnect them).

At least we should clarify what we are talking about. If we can agree on the above, POET would need packaging (like each and every chip does) but can avoid (expensive) stacking.

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