Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: IBM is retaining Canadian Fab
With all due respect MrsSheperd, given the ties between IBM and GF (our possible 3rd party fab) even a POET device and its board and any other ancillary items that make up such an ecosystem will require a packaging solution, no? I don't think Aves99isbackagain presents an unusual question to the board. Everything technology monolithic or not will require a certain level of packaging. Or am I completely off base here? Couldn't there be a relationship developed where such a locale does do some of that work. Or would that speciality be something that stays in house. Given the specialized companies like SYNOPSYS and their TCAD work, is this much of a stretch? Just thinking out loud. Derekwpg
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