Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
Message: MOSIS
Products
MOSIS Products & Services
PRODUCTS |
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Multi-Project Wafer (MPW) Runs This "shared mask' model combines on one mask set designs from multiple customers or diverse designs from a single company. |
Dedicated Runs Dedicated (COT, or Customer Owned Tooling) runs through MOSIS are also available. Dedicated runs can be scheduled to start at any time. |
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Prices and Quotes Costs for fabrication, packaging and assembly services are available online. |
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FABRICATION PROCESSES |
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TSMC featured processes: 40 / 45 nm, 65 nm, 90 nm, and TinyChip Globalfoundries (GF) featured CMOS processes: 28 nm, 40 nm, 65 nm, 0.13 µm, 0.18 µm, and 0.35 µm. IBM featured processes SiGe: 8HP (0.13 µm), 8XP (0.13 µm), and 7WL (0.18 µm) |
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AMS featured processes: 0.18 µm in both CMOS and HV CMOS ON Semi featured CMOS processes I3T80 (0.35 µm), C5 (0.5 µm), and I2T100 (0.7 µm) CMOS imec-ePIXfab featured silicon photonics CMOS process |
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SERVICES |
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Commercial Accounts To work with MOSIS, you must have an account. |
ITAR MOSIS can support fabrication of a project that is subject to export controls as dictated by the US State Department, Directorate of Defense Trade Controls (DDTC). |
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Academic Accounts MOSIS offers three types of accounts for academic institutions, one commercial and two MOSIS Educational Program (MEP) accounts. |
Packaging and Assembly Find information and order instructions here for available packaging (including ceramic, open cavity and fully encapsulated plastic, flip-chip), space-grade inspection, inking, wafer location of parts fabricated through MOSIS. |
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Third Party Services Find information here on design, packaging, plotting, testing, as well as other services available from third-party suppliers. |
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