Scaling III-V integration to 300mm-diameter silicon and beyond

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Scaling III-V integration to 300mm-diameter silicon and beyond

posted on Aug 25, 2014 05:39PM

Seems like these guys are working on a problem Dr.T has already solved, although they did get to 300mm...

http://www.semiconductor-today.com/news_items/2014/AUG/JST_250814.shtml

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