Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: AM isn't here to get us $3 billion

Dear Rainer,

Listening to the Huskeson/Monacha interview AM explains that under 2.0 and IDM, engineers from fab and customer work in close proximity 'no chinese walls' no ' throwing it over the wall'. I believe we are very likely to adopt the joint development model described.

sulasailor

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