Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Global IR Detector Article

posted on May 26, 2014 11:33PM

Link: Global IR Detector (MCT, InGaAs, Pyroelectric, Thermopyle, Microbolometer) Market - Forecast to 2020

'' LWIR detector market is the largest and the fastest growing market for IR detectors, mainly, due to its low price and wide application range. Thermopyle, Pyroelectric, and Microbolometers technologies are the most popular for this spectral range. MCT and InGaAs are expensive technologies, which are more popular in military applications. With the new product developments and advancement of these technologies, they are finding applications in a wider range of products such as bio medical imaging and spectroscopy. ''

The POET IR device addresses the need of military and industrial clients for uncooled mid-wave infrared (MWIR) and long-wave infrared (LWIR) sensors and cameras - for perimeter security, thermography, medical imaging, automotive forward sensors, and smartphone input applications. It has potential advantages over competitive devices in three aspects:

MWIR and LWIR detection in the same pixel. MWIR detection (2-8um) occurs in self-assembled quantum dots with normal incidence light and no diffraction gratings, and uses only the n-type hetero-interface within POET. The p-type interface results in LWIR detection (8-12um). By combining both interfaces within POET, MWIR and LWIR detection will be obtained simultaneously in the same pixel.
Lower device cooling requirements. Near-room-term temperature operation is another advantage of the POET IR detector, possible because of the lower device dark current.
Integrated optoelectronic advantages. The devices provides for the practical integration, for the first time, of the optical detector with the electronic transistor readout and signal-processing circuits. Thus, high-density, single-chip focal-plane arrays are possible using front-side imaging, without resorting to wafer thinning.