Hey guys,

I did a search on some of the patents and I did find a couple of mentions:

https://www.google.com/?tbm=pts#q=ininventor%3A%22Geoff+W+Taylor%22+%22gold%22&safe=off&tbm=pts

It's always noted as part of a "Lift-off" procedure. Here's the wiki link for that kind of additive sacrifical layer:

http://en.wikipedia.org/wiki/Lift-off_%28microtechnology%29

To me, it would indicate that the gold will form contacts and interconnects for the electronics. I've also read that Au can be used in the formation of Bragg reflectors used with optical devices, but it's not clear to me that it's what is happening here.

Overall I think it's clear that what fairchij said is correct, that this job would be for wafer production.