ability to pack hundreds of millions of transistors on a single chip

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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ability to pack hundreds of millions of transistors on a single chip

posted on Oct 10, 2013 03:22PM

FJ ..... I am going to question that statement .......

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