Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: This is bothering me.. The DD is showing we are falling way behind.

Some thing better happen emediatly with POET.

These guys have a III-V chip at 850 nm with two foundries on board to produce thier chip and test chips sent out to potential clients stated in this article as of Q2.

SO WHAT IS POET DOING!!???

http://optics.org/news/4/3/22

Ottawa-based OneChip Photonics, a start-up that has developed photonic integrated circuits (PICs) for optical communications networks, has signed manufacturing agreements with two compound semiconductor foundry firms.

Electronic integration
As well as featuring all of the active optical components required by a transceiver, such as a DFB laser, electro-absorption modulator and waveguide photodetector in a single InP device, OneChip points out that the material also provides the ideal basis for the high-speed electronics needed, such as transimpedance amplifiers and modulator drivers.

And while InP wafers remain far more expensive to produce than silicon, the company adds: “The silicon photonics dream of leveraging high-volume electronic chip production, while combining photonics and electronics onto the same substrate, is ironically best realized in InP.”

Crucially, the manufacturing process developed by OneChip does not depend on any costly epitaxial re-growth stages – important for a market as cost-sensitive as that for DCIs.

IQE and GCS will produce the PIC devices on 4-inch InP wafer substrates, giving OneChip the ability to meet volume demand. Of the four different types of 100 Gb/s PIC developed by the Canadian company, two are already available for partner testing, with the third to become available during Q2 and the fourth before the end of the year.

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