Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Doing DD today. wile we wait. Skorpios’ wafer-scale “STAB” process

Hmmm based on this. POET looks to be a little slow out of the gate. Why do we need 100nm if these guys are going to go to market with 980nm?????

Sorry guys, I am just reporting what I find. FJ, Oogee please jump all ovr this with why POET is better. I see this as being one of those things where people are simply moving in thier own direction and will not really have a high demand for POET if they can use these solutions and not pay huge money for license of POET. These guys are hitting the market now!?

http://optics.org/news/4/3/15

“Quantum leap”
The tunable laser is foundry-manufactured using Skorpios’ wafer-scale “STAB” process for optoelectronic integration and is, according to CEO and founder Stephen Krasulick, just the first example of an entire class of devices enabled by the company’s proprietary approach.

“This is a quantum leap forward in the level of photonic integration, and represents a key missing piece of the silicon photonics puzzle, moving the laser in-chip and delivering a truly single-chip solution,” said Krasulick.

“Not only does this enable for the first time WDM solutions to be deployed within the data center, but also dramatically reduces the capital expenditure requirements for long-haul and metro communication networks.”

• Finisar has also signed a new partnership deal with France-based 3S Photonics that will see the Nozay company become the exclusive supplier of 980 nm laser chips in Finisar’s development of a new packaging platform for cooled laser pump modules.

Finisar is set to implement a manufacturing line based on the platform at its newly expanded facilities in Wuxi, China, and will use the 980 nm modules in fiber amplifier and line card products for the telecom market. 3S will be able to use the new platform to serve its own customers.

With the lasers already field-qualified, pump modules based on the new packaging platform should be available by the middle of the year.

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